Comparison of thermoreflectance and scanning thermal microscopy for microelectronic device temperature variation imaging: Calibration and resolution issues - Archive ouverte HAL Access content directly
Journal Articles Microelectronics Reliability Year : 2008

Comparison of thermoreflectance and scanning thermal microscopy for microelectronic device temperature variation imaging: Calibration and resolution issues

Abstract

We have studied temperature variations on two submicrometric dissipative structures with two different techniques. On one hand, we have used a thermoreflectance imaging technique which is a well-known non contact optical method to evaluate temperature variations but whose spatial resolution is limited by diffraction. On the other hand, we have used a scanning thermal microscope (SThM) to study the thermal behaviour of these small dissipative structures. We present qualitative results obtained by both methods and we compare their advantages and drawbacks in terms of calibration and spatial resolution for thermal measurements on microelectronic devices. In particular, we show how the thermoreflectance coefficient can become an advantage to enhance the image contrast and favour the spatial resolution.

Dates and versions

hal-00747235 , version 1 (30-10-2012)

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Stéphane Grauby, Amine Salhi, Luis-David Patino Lopez, Wilfrid Claeys, Benoît Charlot, et al.. Comparison of thermoreflectance and scanning thermal microscopy for microelectronic device temperature variation imaging: Calibration and resolution issues. Microelectronics Reliability, 2008, 48 (2), pp.204-211. ⟨10.1016/j.microrel.2007.04.008⟩. ⟨hal-00747235⟩

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