Interfacial Interactions Between W (x) N Substrates and a Gold-Tin Alloy. - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Journal of Materials Engineering and Performance Année : 2012

Interfacial Interactions Between W (x) N Substrates and a Gold-Tin Alloy.

Résumé

Au-Sn is an excellent material with superior attributes and is the solder of choice, with no obvious alternatives, in many microelectronic applications. Recently, this alloy has been chosen as a potential candidate for bonding in wafer level hermetic packaging at high temperature using WN as diffusion barrier. In this application, good wetting of WN by the liquid Au-Sn alloy is a key factor for the bonding process. To this end, wetting of W (x) N (covered or not by a gold layer) by Au-Sn20 alloy was studied at 380 A degrees C under high vacuum. Excellent wetting was observed when W (x) N was protected from oxidation by a thin Au layer. The spreading process was found to be followed by a complete dissolution of a protection layer and slight receding of the triple line. Some preliminary bonding tests using Au-Sn alloy were also performed.

Domaines

Matériaux

Dates et versions

hal-00728113 , version 1 (04-09-2012)

Identifiants

Citer

P. Descours, R. Voytovych, Aline Garnier, F. Greco, F. Hodaj. Interfacial Interactions Between W (x) N Substrates and a Gold-Tin Alloy.. Journal of Materials Engineering and Performance, 2012, 21 (5), pp.590-594. ⟨10.1007/s11665-012-0126-2⟩. ⟨hal-00728113⟩
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