Thermo-mechanical simulation of cavity QFN package based on Liquid Cristal Polymer for reliability study - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2012
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hal-00714005 , version 1 (03-07-2012)

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  • HAL Id : hal-00714005 , version 1

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Walide Chenniki, Isabelle Bord-Majek, Jean-Luc Diot, Bruno Levrier, Yves Ousten, et al.. Thermo-mechanical simulation of cavity QFN package based on Liquid Cristal Polymer for reliability study. Micro and Nano Electronics Packaging and Design Forum (MINAPAD), Apr 2012, Grenoble, France. pp.Session A: Reliability. ⟨hal-00714005⟩
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