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Communication Dans Un Congrès Année : 2011

Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization

Cyril Buttay
Amandine Masson
  • Fonction : Auteur
Jianfeng Li
Mihai Lazar
Christophe Raynaud
Hervé Morel

Résumé

Silver sintering is becoming an attractive alternative to soldering, especially for high temperature applications. Indeed, the increase in operating temperature requires new soldering alloys with even higher melting points. Silver sintering, on the contrary, is a solution which only require moderate (<300°C) process temperature. In this paper, we present the implementation of a die attach technique based on sintering of some silver paste, with a special focus on the practical considerations. A good quality bond can be achieved by paying attention to the assembly process.
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Dates et versions

hal-00672619 , version 1 (21-02-2012)

Identifiants

  • HAL Id : hal-00672619 , version 1

Citer

Cyril Buttay, Amandine Masson, Jianfeng Li, Mark C. Johnson, Mihai Lazar, et al.. Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization. HiTEN 2011, Jul 2011, Oxford, United Kingdom. pp.1-7. ⟨hal-00672619⟩
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