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Article Dans Une Revue International Journal of Microwave and Wireless Technologies Année : 2011

Millimeter-wave antenna designs for 60 GHz applications: SoC and SiP approaches

Résumé

Antenna on chip (AoC) and antenna in package (AiP) solutions for millimeter-wave (mmWave) applications and their characterization are presented in this paper. Antenna integration on low resistivity (LR) and high resistivity (HR) silicon substrate are expected. And, in a packaging approach, the combination of antenna on silicon with a material, which has the effect of a “lens”, allowing increasing gain is presented. In a second part, to satisfy beamforming capabilities, a hybrid integration of the antenna on silicon and glass substrates is proposed.
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Dates et versions

hal-00623202 , version 1 (30-03-2022)

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Paternité - Pas d'utilisation commerciale

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Christophe Calvez, Romain Pilard, Christian Person, Jean-Philippe Coupez, François Gallée, et al.. Millimeter-wave antenna designs for 60 GHz applications: SoC and SiP approaches. International Journal of Microwave and Wireless Technologies, 2011, 3 (Special issue 2), pp.179-188. ⟨10.1017/S1759078711000213⟩. ⟨hal-00623202⟩
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