Collective fabrication of all-organic microcantilever chips based on a hierarchical combination of shadow-masking and wafer-bonding processing methods - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Journal of Micromechanics and Microengineering Année : 2011

Collective fabrication of all-organic microcantilever chips based on a hierarchical combination of shadow-masking and wafer-bonding processing methods

Résumé

This paper describes a new collective microfabrication process of all-organic microcantilever chips. This method is based on the hierarchical combination of shadow-masking and wafer-bonding processes. The shadow-masking combines deposition and patterning in one step thanks to spray-coating through a polymer microstencil that gives the opportunity of patterning thermosensitive material such as PMMA. The shadow-masking parameters have been optimized to obtain suspended microcantilevers characterized by a convenient thickness profile. The resulting PMMA structures were then transferred onto SU-8 chips by using an SU-8 waferbonding process. The effect of the UV exposure dose of both SU-8 layers in contact on the bonding quality has been investigated and optimized. With the optimized bonding process we have achieved the large scale transfer of microstructures with a yield of 100% and a bond strength of 50 MPa. These microcantilevers were also tested at resonance, to determine Young’s moduli of patterned polymers. The low values obtained (below 5 GPa) make these organic MEMS structures strong candidates for highly sensitive sensing applications when used in the static mode.
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Dates et versions

hal-00609646 , version 1 (13-11-2014)

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Georges Dubourg, Ludivine Fadel-Taris, Claude Pellet, Isabelle Dufour, Cédric Ayela. Collective fabrication of all-organic microcantilever chips based on a hierarchical combination of shadow-masking and wafer-bonding processing methods. Journal of Micromechanics and Microengineering, 2011, 21, 095021 (9 p.). ⟨10.1088/0960-1317/21/9/095021⟩. ⟨hal-00609646⟩
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