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Article Dans Une Revue Advanced Materials Année : 2009

Silica Sol-gel NanoImprint Resist: a simple route to sequential patterning

Résumé

We have demonstrated that soft thermal nanoimprint of inorganically cross-linked sol-gel (ICSG) films is a powerful method to build up complex structures from simpler templates by sequential imprinting. A condensation threshold has been identified below which a methyl-silane film passes into a fluid state upon heating allowing for low pressure sequential imprinting. By controlling the condensation during a first imprint step, it is possible to tune the deformation incurred during of the second imprint step. Finally the material structured by sequential imprinting can be turned into pure silica by adequate annealing at high temperature.
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Dates et versions

hal-00504481 , version 1 (20-07-2010)

Identifiants

  • HAL Id : hal-00504481 , version 1

Citer

C. Peroz, V. Chauveau, E. Barthel, E. Sondergard. Silica Sol-gel NanoImprint Resist: a simple route to sequential patterning. Advanced Materials, 2009, 21 (5), pp.555-558. ⟨hal-00504481⟩
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