Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage - Archive ouverte HAL
Article Dans Une Revue Microelectronics Reliability Année : 2009

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

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hal-00477613 , version 1 (29-04-2010)

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  • HAL Id : hal-00477613 , version 1

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M. Berthou, P. Retailleau, Hélène Frémont, A. Guédon-Gracia, C. Jéphos-Davennel. Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage. Microelectronics Reliability, 2009, 49, pp.1267-1272. ⟨hal-00477613⟩
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