How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2010

How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies

Fichier non déposé

Dates et versions

hal-00477588 , version 1 (29-04-2010)

Identifiants

  • HAL Id : hal-00477588 , version 1

Citer

Hélène Fremont. How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies. EuroSimE: Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2010, Apr 2010, France. ⟨hal-00477588⟩
25 Consultations
0 Téléchargements

Partager

Gmail Facebook X LinkedIn More