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Communication Dans Un Congrès Année : 2009

Automatic Layout Optimization of a Double Sided Power Module Regarding Thermal and EMC constraints

Résumé

This paper presents an automatic layout process for power electronics integrated modules. The chip position and power layout is automatically generated according to the best EMC/Thermal trade off. Optimization techniques use simple but fairly accurate EMC and Thermal models, presented in this paper. The proposed method is illustrated on a 4 legs 2kW inverter used for aircraft applications. The realization will use double sided technology.
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Dates et versions

hal-00421937 , version 1 (05-10-2009)

Identifiants

  • HAL Id : hal-00421937 , version 1

Citer

Sylvain Mandray, Jean-Michel Guichon, Jean-Luc Schanen, Sébastien Vieillard, Arezki Bouzourene. Automatic Layout Optimization of a Double Sided Power Module Regarding Thermal and EMC constraints. Energy Conversion Congress and Expo, Sep 2009, San José, United States. pp.CDROM. ⟨hal-00421937⟩

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