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Article Dans Une Revue Microelectronics Reliability Année : 2009

A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages

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hal-00414958 , version 1 (10-09-2009)

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  • HAL Id : hal-00414958 , version 1

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M.A. Bahi, H. Fremont, J.-P. Landesman, A. Gentil, P. Lecuyer. A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages. Microelectronics Reliability, 2009, 49 (Issues 9-11), pp 1273-1277. ⟨hal-00414958⟩
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