Impact of direct CMP on porous ULK properties and interconnect propagation performance on a wide frequency bandwidth - Archive ouverte HAL
Communication Dans Un Congrès Année : 2008

Impact of direct CMP on porous ULK properties and interconnect propagation performance on a wide frequency bandwidth

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hal-00397928 , version 1 (23-06-2009)

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  • HAL Id : hal-00397928 , version 1

Citer

M. Gallitre, S. Gall, A. Farcy, B. Blampey, B. Icard, et al.. Impact of direct CMP on porous ULK properties and interconnect propagation performance on a wide frequency bandwidth. 25th Advanced Metallization Conference, AMC 2008, Sep 2008, -, France. ⟨hal-00397928⟩
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