Plasma challenges of porous SiOCH patterning for advanced interconnect levels - Archive ouverte HAL
Communication Dans Un Congrès Année : 2008

Plasma challenges of porous SiOCH patterning for advanced interconnect levels

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hal-00397847 , version 1 (23-06-2009)

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  • HAL Id : hal-00397847 , version 1

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T. Chevolleau, T. David, N. Posseme, Maxime Darnon, F. Bailly, et al.. Plasma challenges of porous SiOCH patterning for advanced interconnect levels. 55th American Vacuum Society Symposium, 2008, boston, United States. ⟨hal-00397847⟩
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