Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2009) - Archive ouverte HAL
Ouvrages Année : 2009

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2009)

Tarik Bourouina
Electronique, Systèmes de communication et Microsystèmes
CV
B. Courtois
  • Fonction : Auteur
  • PersonId : 830244
Circuits Multi-Projets
R. Ghodssi
  • Fonction : Auteur
Dept. of Electrical and Computer Engineering
J.M. Karam
  • Fonction : Auteur
Memscap
A. Soma
  • Fonction : Auteur
Department of Mechanics
H.Y. Yang
  • Fonction : Auteur
Center of Nanoscience and Nanotechnology

Résumé

This Symposium is a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland and in 2006 and in 2007 in Stresa, Italy and in 2008 in Nice, France. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. We hope you enjoy the technical presentations of 2 conferences - CAD, Design and Test / Microfabrication, Integration and Packaging -, of 2 joint invited talks, and of a special session on 3D Integration of MEMS.

Mots clés

Technology CAD in general Modeling and simulation of fabrication processes Devices and components (sensors actuators MEMS/MOEMS libraries and IP Signal processing Integrated CAD tools Numerical simulation Yield estimation Failure mechanisms Fault modeling Fault simulation and test pattern generation Mechanical simulation Thermal evaluation Interoperability of CAD/CAE tools Multiphysics simulation Structured design methodologies Languages for interchange data among designs and tools Model order reduction Integrated processes (micromachining micromolding) Process integration between MEMS and electronics Microlithography issues unique to MEMS/MOEMS Manufacturing Materials Assembly technologies Packaging for harsh environments MOEMS packaging RF and microwave packaging Test structures actuators) Dimensional measurements Physical measurements Failure analysis Reliability Characterization Process monitoring Non destructive evaluation

Domaines

Micro et nanotechnologies/Microélectronique

EDA Publishing Association  : Connectez-vous pour contacter le contributeur

https://hal.science/hal-00395521

Soumis le : lundi 15 juin 2009-16:50:34

Dernière modification le : mercredi 18 décembre 2024-09:16:22

Fichier non déposé

Dates et versions

hal-00395521 , version 1 (15-06-2009)

Identifiants

  • HAL Id : hal-00395521 , version 1

Citer

Tarik Bourouina, B. Courtois, R. Ghodssi, J.M. Karam, A. Soma, et al.. Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2009). EDA Publishing Association. EDA Publishing Association, pp.429, 2009, Proceedings. ⟨hal-00395521⟩

Exporter

BibTeX XML-TEI Dublin Core DC Terms EndNote DataCite

Collections

UGA CNRS UNIV-MLV CNAM ESYCOM CV_ESYCOM ESIEE-PARIS UNIV-EIFFEL INTERDISCIPLINARITES
139 Consultations
0 Téléchargements

Partager

More