Comments on the Quantification of Mechanical Adhesion Energy of Thermal Oxide Scale on Metallic Substrate Using Tensile Test - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2008

Comments on the Quantification of Mechanical Adhesion Energy of Thermal Oxide Scale on Metallic Substrate Using Tensile Test

Fichier non déposé

Dates et versions

hal-00388837 , version 1 (27-05-2009)

Identifiants

  • HAL Id : hal-00388837 , version 1

Citer

S. Chandra-Ambhorn, P. Promdirek, G. Lothongkum, Y. Wouters, A. Galerie. Comments on the Quantification of Mechanical Adhesion Energy of Thermal Oxide Scale on Metallic Substrate Using Tensile Test. VIIth Symposium on High Temperature Corrosion and Protection of Materials, 2008, France. pp.907-914. ⟨hal-00388837⟩

Collections

UGA CNRS SIMAP
47 Consultations
0 Téléchargements

Partager

Gmail Facebook X LinkedIn More