In industrial power modules, the most common die-level interconnect technology is wire bonding. In niche markets, where performances such as high power density, high compactness, high switching frequency and good thermal management are required, wire bonds must be removed due to electrical, thermal and mechanical (reliability) limits. 3D packaging technologies are a solution. In this paper, wire bonding technology and 3D packaging technologies are described. A comparison of these technologies is then established from literature data