Industrial and lab-scale power module technologies : A review - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2007

Industrial and lab-scale power module technologies : A review

Ludovic Ménager
  • Fonction : Auteur
  • PersonId : 879189
  • IdRef : 133482014
Vincent Bley
  • Fonction : Auteur
  • PersonId : 970039

Résumé

In industrial power modules, the most common die-level interconnect technology is wire bonding. In niche markets, where performances such as high power density, high compactness, high switching frequency and good thermal management are required, wire bonds must be removed due to electrical, thermal and mechanical (reliability) limits. 3D packaging technologies are a solution. In this paper, wire bonding technology and 3D packaging technologies are described. A comparison of these technologies is then established from literature data
Fichier non déposé

Dates et versions

hal-00369385 , version 1 (19-03-2009)

Identifiants

Citer

Ludovic Ménager, Christian Martin, Bruno Allard, Vincent Bley. Industrial and lab-scale power module technologies : A review. 32nd IEEE IECON, Nov 2006, Paris, France. pp.2426 - 2431, ⟨10.1109/IECON.2006.347559⟩. ⟨hal-00369385⟩
68 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More