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Communication Dans Un Congrès Année : 1998

Analysis of thermomechanical stresses in a 3D packaged micro electro mechanical system

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hal-00183144 , version 1 (29-10-2007)

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  • HAL Id : hal-00183144 , version 1

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Claude Pellet, Marc Lecouve, Hélène Fremont, A. Val. Analysis of thermomechanical stresses in a 3D packaged micro electro mechanical system. 9th European Symposium Quality and Reliability of Electron Devices, 1998, Denmark. pp.1. ⟨hal-00183144⟩
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