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Article Dans Une Revue Microelectronics Reliability Année : 1998

Analysis of thermomechanical stresses in a 3D packaged micro electro mechanical system

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hal-00183118 , version 1 (29-10-2007)

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  • HAL Id : hal-00183118 , version 1

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Claude Pellet, Marc Lecouve, Hélène Fremont, A. Val. Analysis of thermomechanical stresses in a 3D packaged micro electro mechanical system. Microelectronics Reliability, 1998, 38, pp.1. ⟨hal-00183118⟩
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