An Assessment of Lead-Free Soldering for Automotive Applications: Influence of the Components Finishes on the Reliability of Solder Joints - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2002
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hal-00179916 , version 1 (17-10-2007)

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  • HAL Id : hal-00179916 , version 1

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Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini. An Assessment of Lead-Free Soldering for Automotive Applications: Influence of the Components Finishes on the Reliability of Solder Joints. International Conference on Electronics Packaging IEMT/IMC Symposium, Apr 2002, Tokyo, Japan. ⟨hal-00179916⟩
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