An attempt to model the variability of short crack development in high-cycle fatigue is made by coupling finite element computations of the stresses ahead of a microcrack in a polycrystal with simulations of crack growth along slip planes based on discrete dislocations dynamics. The model predicts a large scatter in growth rates related to the crystallographic disorientations along the crack path. It also describes qualitatively the influence of the mean grain size and the fact that overloads may suppress the endurance limit by allowing arrested cracks to cross the grain boundaries.