Article Dans Une Revue Plating and Surface Finishing Année : 2000

The morphology and electrochemical behavior of electrodeposited nickel onto metallized silicon

Résumé

Electrodeposition of nickel from a nickel sulfamate electrolyte onto five substrates (copper, metallized glass, metallized copper and metallized n-type and p-type silicon) was studied. Analysis by scanning electron microscopy showed the first step of growth and the morphology of a thick nickel coating. The nature of the substrate had a great influence on the electrocrystallization via the density of germination. Both cathodic polarization and impedance spectroscopy diagrams revealed the electrochemical behavior that characterizes the silicon/metal interface and allows classifying the metallic interfaces into three groups, depending on conductivity.

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Dates et versions

hal-00008673 , version 1 (13-09-2005)

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  • HAL Id : hal-00008673 , version 1

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Laurent Robert, Skandar Basrour, M. Wery, F. Sittler. The morphology and electrochemical behavior of electrodeposited nickel onto metallized silicon. Plating and Surface Finishing, 2000, 87(5), pp.153-9. ⟨hal-00008673⟩
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