The morphology and electrochemical behavior of electrodeposited nickel onto metallized silicon
Résumé
Electrodeposition of nickel from a nickel sulfamate electrolyte onto five substrates (copper, metallized glass, metallized copper and metallized n-type and p-type silicon) was studied. Analysis by scanning electron microscopy showed the first step of growth and the morphology of a thick nickel coating. The nature of the substrate had a great influence on the electrocrystallization via the density of germination. Both cathodic polarization and impedance spectroscopy diagrams revealed the electrochemical behavior that characterizes the silicon/metal interface and allows classifying the metallic interfaces into three groups, depending on conductivity.