Extracting electrical parameters such as barrier height inhomogeneities (BHi) from the forward bias can be very challenging in metal/semiconductor (M/Sc) contacts characterized by low barrier height and high series resistance. In this work we demonstrate that the reverse bias characteristics can be used as an efficient alternative method to investigate the inhomogeneity of low barrier height in M/Sc contacts. In particular, the BHi in Ti/p-strained Si0.95Ge0.05 Schottky barrier diodes (SBD) has been investigated using reverse current–voltage-temperature (IR-VR-T) characteristics over the temperature range of 100–300 K. The temperature dependence of the measured barrier heights (ΦRBp) using reverse-bias is successfully explained in terms of a thermionic emission (TE) current transport associated with Gaussian distribution of the barrier height due BHi. The mean homogeneous barrier height (Ф and its corresponding standard deviation (σRs) were determined for different reverse voltages. A decrease in Ф and an increase in σRs with increasing reverse bias are observed, indicating a large barrier height distribution upon high applied reverse bias. The deduced average zero-field barrier height (Ф) from IR-VR agrees well with the corresponding value determined from the forward characteristics. Moreover, the reverse bias extracted values for Richardson constant A* based on BHi model, are found in fair agreement with the reported theoretical value of 32 A cm−2 K−2 for our p-type strained Si0.95Ge0.05 alloy. Finally, the results obtained on Pd/n-type Si0.90Ge0.10 structure shown in this work fully support the utilization of such reverse bias method.