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Traitements plasmas Post Gravure pour l'intégration des matériaux SiOCH poreux dans les interconnexions en microélectronique
Régis Bouyssou
Micro et nanotechnologies/Microélectronique. Université de Grenoble, 2009. Français. ⟨NNT : ⟩
Theses
tel-00679654v1
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Study of porous SiOCH patterning using metallic hard mask: challenges and solutions
Nicolas Posseme
,
Thibaut David
,
Thierry Chevolleau
,
Maxime Darnon
,
Fanny Bailly
,
et al.
Journal articles
hal-00629313v1
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Porous SiOCH integration: Etch challenges with a trench first metal hard mask approach
Nicolas Possémé
,
Thibaut David
,
Thierry Chevolleau
,
Maxime Darnon
,
Philippe Brun
,
et al.
Chinese Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China. pp.389-394, ⟨10.1149/1.3567609⟩
Conference papers
hal-00625347v1
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Development of porosimetry techniques for the characterization of plasma-treated porous ultra low-K materials
Christophe Licitra
,
Thierry Chevolleau
,
Régis Bouyssou
,
Mohamed El Kodadi
,
Georg Haberfehlner
,
et al.
Journal articles
hal-00625361v1
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Porous SiOCH integration: etch challenges with a trench first metal hard mask approach
Nicolas Possémé
,
Thibaut David
,
Thierry Chevolleau
,
Maxime Darnon
,
Philippe Brun
,
et al.
Journal articles
hal-00647490v1
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